运输和发电审计准则(1)东莞TPG_AC7119

1 SCOPE

This checklist supplements the TPG-AC7119 core checklist. This checklist shall apply to suppliers seeking accreditation engaged in fabrication of organic High Density Interconnect (HDI) Printed Boards (PBs) and/or HDI layers with microvia technology working in accordance with the Class 3 requirements of IPC-6012 and IPC-6016 Standards or standards as directed by Customer.

1.1 Purpose

Approval to the requirements of TPG-AC7119 is a prerequisite for accreditation to this

supplemental checklist.

2 GENERAL INSTRUCTIONS

References

IPC Publications: Available from IPC, 3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015-

1219

IPC-6012: Qualification and Performance Specification for Rigid Printed Boards

IPC-6016: Qualification & Performance Specification for High Density Interconnect (HDI)

Layers or Boards

3 COMPANY INFORMATION

3.1 Audit Scope

The process scopes below identify the contents of the checklist. The auditor is expected to utilize

the eAuditNet scope verification process to identify the process scopes that are utilized internally.

The column for internal is to be used only when utilizing the paper checklist (e.g. internal / pre audits). Any process scopes that are outsourced are to be identified in the table below.

Para Ref Process Internal Outsourced

4.0 General [ ] [ ]

5.0 Hole Filling Material Control

5.1 Conductive Hole Fill Material for Blind and Buried Vias [ ] [ ]

5.2 Non Conductive Hole Fill Material for Blind and Buried Vias [ ] [ ]

6.0 Inner Layers Registration [ ] [ ]

7.0 Material Lamination [ ] [ ]

8.0 Drilling

8.1 Mechanical Drilling [ ] [ ]

8.2 Laser Drilling [ ] [ ]

9.0 Via Hole Filling Process

9.2 Oxide Coating / Oxide Replacement Coating [ ] [ ]

9.3 Buried Via Hole Filling Process [ ] [ ]

9.4 Blind Via Hole Filling Process [ ] [ ]

10.0 Final Validation

10.1 General [ ] [ ]

10.2 Lifted Lands [ ] [ ]

10.3 Workmanship (shop floor) [ ] [ ]

10.4 Dimensional Requirements

10.4.1 Hole Pattern Accuracy [ ] [ ]

10.4.2 Registration (Internal) [ ] [ ]

10.4.3 Annular Ring (External) [ ] [ ]

10.5 Conductor Definition

10.5.1 Conductor Width [ ] [ ]

10.6 Structural Integrity

10.6.1 Microvia Integrity [ ] [ ]

10.6.2 Filled Vias [ ] [ ]