SiP Technology

System in Package (SiP) is the technology that will enable the next era of integration for electronic systems and is the technology Octavo Systems leverages to make our products. Since the invention of the integrated circuit the focus of the industry has been to create components by cramming more transistors into a single piece of silicon. This has led to 2 major problems:

The increased cost to keep up with Moore’s Law
The increased complexity of components making it harder for designers to use them

System in Package solves these problems by changing the focus from creating a single component to creating a System that looks like a component. By being a “System” the complexities that go into using a single component can be abstracted away leaving a building block that can be easily integrated into a system.

Also, since the focus of System in Package is to create a System instead of a Component, SiP can use silicon from the best individual processes to achieve the desired integration. This removes the need to continue to invest billions in the next fab technology node and allows System in Package devices to integrate functions that would otherwise be impossible to integrate.

System in Package is the next step on the electronics integration path and Octavo Systems can help you take that step. Using system in Package in your design will:

Get you to market faster
Reduce the Size of your Design
Save you money

Keep reading to learn more about System in Package, how it can benefit your design, and what makes Octavo Systems unique. Or you can contact us to talk to one of our System in Package experts!

What is a System in Package?

A System in Package, which can also be called a Multi-Chip Module (MCM), is an electronic device (shown on the right in the above figure) that to a system designer looks like a single Integrated Circuit (IC), but happens to contain the functions of all the components highlighted on the left of the above figure. It is a building block module that can be used to create a larger system or could be a system itself (see the Complete System in Package).

A SiP integrates multiple Integrated Circuits (ICs) along with their supporting passive devices into a single package. It leverages semiconductor manufacturing processes and bare silicon die to create a tightly coupled module. It is a system by design and a component by construction.

Octavo Systems continues to push what is capable in System in Package through our products. In the future, SiPs will also integrate sensors, energy storage elements (e.g., batteries and super capacitors), and perhaps even non silicon components.

Sign up for our mailing list and stay up to date on the latest in System in Package technology

Name*

First Last
Enter Your Email**

Why use SiP Technology?

System in Package provides many benefits for designs that utilize it. Unfortunately, previously only the largest companies with significant volumes could take advantage of them. Through Octavo Systems standard products, we are making System in Package technology available to all. Now any design can benefit from the advantages of using a SiP.

These advantages can generally be broken down into 3 main categories:

Faster time to market/Shorter Design Cycles
Smaller size
Lower total cost of ownership

Read on to learn more or feel free to contact us to see how SiP can benefit your design.

Faster Time to Market

The first thing a designer will notice when using a System in Package from Octavo Systems is how a design can be simplified, saving significant engineering work, which enables the design to get to market sooner.

Octavo Systems SiPs accomplish this by:

Abstracting Complexity
Octavo Systems SiPs are building block modules. They are designed to provide an easy to use subsystem that can be plugged directly into your design. For example, some of our devices integrate a microprocessor, DDR, power management, oscillators, and passives into a single package providing the designer a prebuilt processing module. Using this SiP module means the designer doesn’t have to spend time on tedious tasks like DDR routing and power sequencing that don’t differentiate the end product. They can spend their time focused on features that will differentiate their system and add the most value to their customers. The Figure below compares 2 equivalent systems, one is designed with discrete components the other is designed with the a SiP. The amount of work using a SiP can save is astounding.

Enabling Quicker Validation
Octavo Systems fully validates and tests each one of our System in Package devices. This allows the designer to just check the integration of the SiP into the system, then focus on validating the new key sections. Removing the need to validate over 100 components can save significant engineering effort.
Increasing First Pass Success
Finally, by using a known good and tested System in Package the chances of the first design working as expected is significantly increased. The System in Package removes numerous components and hundreds of interconnections significantly reducing the chances of design errors. Removing the need for multiple revisions of a design not only saves money but could get you to market months if not years sooner.

Because first pass success can be so vital to the success or failure of a device, Octavo Systems also provides a host of Applications Notes and a Design Review Consulting service to further increase to chances of a new design working the first time.

Smaller Size

One of the biggest and most notable advantage of using System in Package is the small size of the integrated subsystem. Since System in Package utilizes Integrated Circuit Manufacturing processes along with bare silicon die, SiP significantly reduces the size of the subsystem when compared to a discrete implementation. All of Octavo Systems SiPs reduce the space required for a system by 50% and some over 60%. This reduction in size allows designers to reduce the size of their PCB, saving money. Even more exciting the small size allows designs to use this technology in new smaller form factors that wouldn’t otherwise be possible.

Find out how much smaller your design can be with SiP.

Reduced cost of ownership

Finally, SiP will reduce the overall cost of the product for its entire life, especially when compared to other design options. SiP has benefits that will save money at every stage of a product lifecycle. Here are just a few of the ways SiPs reduce the cost of ownership:

Reduced Engineering Costs
As discussed earlier using SiP significantly reduces the effort to complete a design. This could save hundreds of thousands of dollars in engineering time and materials alone. Add to this the benefit of getting to market faster and the cost savings of using a SiP are significant.
Reduced PCB Costs
System in Package simplifies the use of components. This simplification means a design can use lower cost PCB design rules to develop their board. Octavo Systems SiPs also reduce the number of layers required in a PCB by 33% to 50%. The reduction of layers and the ability to use lower cost design rules means lower cost PCBs for the life of the product.
Reduced Assembly Costs
System in Package integrates hundreds of components into a single 1. This 100-fold reduction in placements saves significant money during the manufacturing process. The cost of assembly is driven by labor, time and, materials. Reducing the number of components to be placed reduces the amount of labor required to set up the assembly line and then it reduces the time it takes to do the assembly. Together these savings can be significant and are realized every time a single board is assembled.
Reduced Cost of Failure
System in Package increases the reliability of a design and thus reduces the likelihood and cost of failures. SiP does this primarily by increasing the reliability of the PCB to components solder joint connections. By replacing hundreds of components with one, hundreds of solder joints are removed and hundreds of potential failure points. Then with the components in the SiP encapsulated in mold compound they are protected from different environmental conditions, all creating a more reliable system.
Reduced Supply Chain Cost
Using System in Package also simplifies the supply chain. Hundreds of components from dozens of different manufacturers now get replaced by 1. Having to manage fewer parts and fewer suppliers will free up the supply chain team to do more valuable tasks. Also, because Octavo Systems manages the inventory of all the components inside the SiP, Supply Chain never has to tie up cash trying to secure large quantities of hard to get devices just so they can build a small batch of products.

Contact our SiP experts to learn more ways SiP can help you reduce the cost of your design.

Why Octavo Systems?

Octavo Systems is pioneering the use of System in Package technology to simplify the design and manufacture of electronic systems. Our entire business is built to make adopting technology as easy as possible. From our extensive Intellectual Property portfolio, to our ISO9001:2015 certified (Certificate Number: 112130.00) processes – everything we do is centered around the customer experience. We provide extensive support through our sale channel, forums, application notes, reference designs and services. Our world class manufacturing ensures the absolute highest quality of our system in package while supporting any volume.

Octavo Systems System in Package solutions will get you to market faster and at a lower total cost while leveraging the latest in semiconductor technology.

Sign up for our mailing list to stay up to date with the latest from Octavo Systems and our System in Package technology.

Name*

First Last
Enter Your Email**

System in Package