System in Package (SiP) DSMBGA Antenna in Package (AiP)
Create highly integrated products with a smaller package and increased functionality
Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.
Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.
Amkor Technology defines advanced SiPs as multi-component, multifunction products in an IC package. They require high-precision assembly technologies, which leverage Amkor’s strengths.
- Size reduction
- Ultra-thin package
- Thin substrate with core and coreless using finer line and spacing
- Conformal and compartmental shielding
- Low filler size for mold underfill
- Fine pitch flip chip and copper pillar
- Double side assembly
- Test development and production test
- Turnkey solution