上饶市MedAccred _AC8121电子电缆和线束组件的审核标准 （47）

25.11 C- Is the setup of soldering equipment being carried out in accordance with procedures?YES/NO

25.12 C- Is the procedure for soldering being followed?YES/NO

25.13 C- Is the process that defines the acceptance criteria of soldered connections available and being followed?YES/NO

25.14C- Are solder and flux used within the required shelf-life?YES/NO

25.15 C- Are solder joints inspected with the required magnification?YES/NO

25.16 C- Are the soldering tools set to the specified temperature for the solder alloy being used and are there controls in place that prevent the operator from arbitrarily adjusting the soldering iron tip temperature beyond the allowable adjustment?YES/NO

25.17 C- Is the wire tinned in accordance with the procedure prior to soldering?YES/NO/NA

25.18 C- Is cross contamination between different solder alloys being prevented?YES/NO

25.19 C- Is cross contamination between different fluxes being prevented?YES/NO

25.20 C- Is there evidence that cleanliness requirements for soldered connections are being followed?YES/NO

25.21C- If required, are soldered joints with shrink sleeve requirements inspected following shrinking for reflow of solder, or other damage to the area?YES/NO/NA

25.22 C- If required, are soldered joints with shrink sleeve requirements cleaned before the sleeving is shrunk?YES/NO/NA

25.23 C- If no-clean flux is required, are no-clean fluxes used, and the joints soldered with it inspected as per procedures?YES/NO/NA