麻城市MedAccred _AC8121电子电缆和线束组件的审核标准 （64）

31.1.1.10 P- Cure times and temperatures?YES/NO

31.1.1.11 P- Mix ratio and method (including tools and wait times after mixing prior to use)?YES/NO

31.1.2 P- Is there a procedure to ensure connectors and other parts are not contaminated with molding material?YES/NO

31.1.3 P- Is there a procedure to ensure connectors and other parts are not damaged from the molding process?YES/NO

31.1.4 P- Is there a procedure for rework of molded material?YES/NO/NA

Audit Note: NA applies when rework is not allowed.

31.1.5 C- Is there evidence that cleanliness is verified before molding?YES/NO

31.1.6 C- Are the molding and masking materials used within shelf-life?YES/NO

31.1.7 C- Is the molding material to be used verified in accordance with the procedure?YES/NO

31.1.8 C- Are the requirements for the work life / pot life of the molding material being met?YES/NO

31.1.9 C- Are the requirements for the mix ratios of the molding material being met?YES/NO

31.1.10C- If required, is the molding material removed in accordance with procedures?YES/NO

31.1.11 C- If required, is the masking for molded parts applied and removed in accordance with procedures?YES/NO/NA

31.1.12 C- Are all drawings, machine programs, written instructions, and product specific fixtures for molding under configuration control and do they match the assembly traveler?YES/NO