南昌市MedAccred _AC8121电子电缆和线束组件的审核标准 （45）

24.WIRE TINNING SECTION NA

24.1 P- Is there a procedure that defines the solder alloy and flux type to be used?YES/NO

Audit Note: Solder and Flux are addressed in IPC/WHMA-A-620 para

4.1.1.1 & 4.1.1.2, respectively.

24.2P- Is there a procedure that defines the acceptance criteria for wire tinning?

YES/NO

24.3 P- Is there a procedure that specifies the limits for solder wicking?YES/NO

24.4 P- If nickel plated wire is used, is there a procedure for the preparation and/or tinning of nickel plated wire?YES/NO/NA

24.5C- Are the correct alloys and fluxes being used for tinning wires, in accordance with the procedure?YES/NO

24.6 C- Are tinned wires being cleaned in accordance with the procedure?YES/NO

24.7 C- Is the wire tinned in accordance with the procedure prior to soldering?YES/NO

24.8 C- If solder wicking has occurred into a portion of the wire that is to remain flexible, is the wire prevented from being used?YES/NO

24.9 C- If nickel plated wire is used, are nickel plated wires being prepared and/or tinned in accordance with procedures?YES/NO/NA

25.SOLDERING SECTION NA

25.1 P- Is there a procedure for soldering per J-STD-001?YES/NO

25.2 P- Is there a procedure that defines the acceptance criteria of soldered connections?YES/NO