System in Package | ASE Group

Turnkey Solution

ASE offers customers complete SiP manufacturing capability including system design, software development, module testing and electrical heat transfer simulation technology to enable smaller, higher performance, lower power consumption and more cost effective end products.

System Co-Design
· SiP Electronic Design Automation (EDA) solution
· RF Circuit design
· Antenna Design
· Shielding Solution
· Substrate Layout design

Packaging Consultancy
· Package selection & configuration
· Design rule guideline
· Process capability
· Reliability verification

System Test Consultancy
· RF Wafer probing
· RF ATE Platform
· EVB design & fabrication
· Testing tooling design
· Final test solution development