宜昌市MedAccred _AC8121电子电缆和线束组件的审核标准 （68）

32.POTTING SECTION NA

32.1 Potting Process SECTION NA

32.1.1 P- Is there a procedure to define and control the potting material, including:

32.1.1.1 P- Cleanliness requirements of parts to be adhered?YES/NO

32.1.1.2 P- Shelf-life of materials to be used?YES/NO

32.1.1.3 P- Work time after mixing / pot life?YES/NO

32.1.1.4 P- Methods of adhesive application and removal?YES/NO/NA

32.1.1.5 P- Application and removal of temporary masking material?YES/NO/NA

32.1.1.6 P- Set up, configuration, and cleaning of tools, jigs, fixtures, nozzles, racks, etc.?YES/NO

32.1.1.7 P- Calibration of gauges, scales, etc.?YES/NO/NA

32.1.1.8 P- Environmental control (humidity, temperature, FOD, ventilation, etc.) in room?YES/NO

32.1.1.9 P- Set up, use, preventative maintenance, and calibration of curing ovens?YES/NO/NA

Audit Note: NA only applies when ovens are not used (i.e. air cure only).

32.1.1.10 P- Cure times and temperatures?YES/NO

32.1.1.11 P- Mix ratio and method (including tools and wait times after mixing prior to use)?YES/NO/NA

Audit Note: NA only applies for one-part potting materials.